Innovative MicroPackaging

OFFER

Component transfer by flip-chip process, thermocompression up to 17 kg at 250°C
Bonding and wiring on antenna, rigid and flexible PCB, reel to reel film
Bonding on PCB in front and back side
Ball bonding : gold wire 15 µm; 150°C to 250°C
Realization of study feasability according to your needs

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In french

Datacon 2200 Plus 2018
Wire Bonder Flexible - 15µm

ACHIEVEMENTS:

Confidential

EQUIPMENT:

Pick and Place equipment purchased with the 2018 FEDER funding

Automatic glob top module