Innovative MicroPackaging

OFFER

  • Component transfer by flip-chip process, thermocompression up to 17 kg at 250°C
  • Bonding and wiring on antenna, rigid and flexible PCB, reel to reel film
  • Bonding on PCB in front and back side
  • Ball bonding : gold wire 15 µm; 150°C to 250°C
  • Realization of study feasability according to your needs

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J’Y VAIS

ACHIEVEMENTS:

Confidential

 

EQUIPMENT: