Non destructive or destructive failure analysis for components, packages...
Thickness and flatness characterization for conductive, insulating or semiconductor layers
Chemical and mechanical analysis for solid, liquid or powder-like material
Electrical test for components and 8'' wafer, temperature between 20 and 200°C
ACHIEVEMENTS:
3D X-Ray analysis
Metallic multi-layer characterization
SEM analysis
EQUIPMENT:
2D/3D X-Ray
Electro-mechanical characterization
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