Offers and Services

Material characterization and failure analysis

OFFER:

  • Non destructive or destructive failure analysis for components, packages...
  • Thickness and flatness characterization for conductive, insulating or semiconductor layers
  • Chemical and mechanical analysis for solid, liquid or powder-like material
  • Electrical test for components and 8'' wafer, temperature between 20 and 200°C

ACHIEVEMENTS:

 

EQUIPMENT: