MicroPackaging

OFFER on packages, reel to reel film and flexible or rigid PCB

  • Grinding and sawing for standard or muli-project wafers between 4 and 12 inches 
  • Die bonding with standard or automatic process, conductive or non conductive glue, flip-chip process is available, die shear
  • Soldering for passive components (resistance, capacitor ..)
  • Ball bonding process with gold wire, 25 µm, between 150°C and 250°C, pull test, ball shear
  • Glop top or dam and fill process with resin or lid laying, module insertion in card

Accédez aux équipements proposés

J’Y VAIS

ACHIEVEMENTS:

EQUIPMENT: