- Grinding wafers between 4 and 12 inches and individual dice up to 75 µm, plasma stress release
- Sawing for standard or muli-project wafers between 4 and 12 inches, processes DBG and half cut available
- Sawing quartz, sapphire samples...
- Automatic picking for dice on wafer and put in gel pack. Die size could be from 500 µm2 to 2 cm*3 cm
- Compatibility with waffle pack, Gel Box or wafer on frame
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