Die preparation

OFFER

  • Grinding wafers between 4 and 12 inches and individual dice up to 75 µm, plasma stress release
  • Sawing for standard or muli-project wafers between 4 and 12 inches, processes DBG and half cut available
  • Sawing quartz, sapphire samples...
  • Automatic picking for dice on wafer and put in gel pack. Die size could be from 500 µm2 to 2 cm*3 cm 
  • Compatibility with waffle pack, Gel Box or wafer on frame

Accédez aux équipements proposés

J’Y VAIS

ACHIEVEMENTS:

EQUIPMENT: