layout area (X/Y/Z) 229 mm x 305 mm x 7 mm (9” x 12” x 0.28”)
Max. material size (X/Y/Z) 239 mm x 315 mm x 7 mm (9.4” x 12.4” x 0.28”)
Laser wavelength 532 nm Max.
laser power 12 W
Laser pulse frequency 25 – 300 kHz
Diameter of focused laser beam 20 ± 2 μm (0.78 ± 0.08 mil)
Structuring speed 12 cm2 /min (1.9 in2 /min)a on laminated substrates 18 µm (0.5 oz) Cu
Minimum line/space 75 μm / 25 μm (2.9 mil / 0.9 mil)a on FR4 18 μm (0.5 oz) Cu
Positioning accuracy in the scan field ± 10 μm (± 0.39 mil) Repeatability in the scan field ± 2.2 μm (± 0.09 mil) Dimensions (W x H x D) 910 mm x 1650 mm x 795 mm (35.8” x 64.9” x 31.3”)b
Weight 350 kg (772 lbs)
Power supply 110 – 230 V, 50 – 60 Hz, 1.5 kW
Compressed air supply Min. 6 bar; 185 l/min (min 87 psi; 185 l/min)
Cooling Air-cooled (internal cooling cycle)
Software LPKF CircuitPro Advanced