OFFER on packages, reel to reel film and flexible or rigid PCB
- Grinding and sawing for standard or muli-project wafers between 4 and 12 inches
- Die bonding with standard or automatic process, conductive or non conductive glue, flip-chip process is available, die shear
- Soldering for passive components (resistance, capacitor ..)
- Ball bonding process with gold wire, 25 µm and 15µm, between 150°C and 250°C, pull test, ball shear
- Glop top or dam and fill process with resin or lid laying, module insertion in card
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