Printed electronics is a merging technology associating microelectronics and foil technologies to design flexible Integrated Smart Systems (ISS).
Printed electronics is covering a wide range of ISS products: smart cards, RFID Tags, Wireless sensors, Smart label, Smart clothing, Chemical and biology sensors,
and is particularly useful for flexible interconnect technologies: wafer printing for 3D integration, printed wires.
Micro-PackS platform has invested up-to-date R&D printers to develop and prototype innovative low cost ISS combining ‘printed’ functionalities (interconnects, antennas, energy microsources, sensors…) with silicon IC chips on plastic foils.
Micro-PackS offers expertise in following fields:
- Ink development
- Surface treatment
- Printing conditions
- Sintering/annealing treatments
from a wide range of R&D equipments:
- Inkjet printers
- Screen printer
- Sintering and oven equipments
- Associated characterization tools
In addition to micropackaging line, major equipments are inkjet printer, screen printer, sintering/oven equipments and associated characterization equipments.
|your needs||Our answer|
|Manufacturing process development||Access to pre-industrial equipments|
|Marketing and Strategic desire to make products flexible (portable or implantable) incorporating electronics||Microelectronics on plastic materials|
|Unusual properties (weight, flexibility)|
|Electronic equipment increasingly communicating||Low manufacturing cost|
|Reducing manufacturing costs of various products: Tags, ID cards, active packaging, labels and smart clothes, biological and chemical sensors||Wide fields of application: transistors, photodetectors, (LEDs, batteries, NVM Emerging products…) with strong integration capabilities|
|Synergies between chemists, micro electronics and equipment|