Package characterization and failure analysis
These services area is dedicated to micro-assemblies and materials characterization.
It includes resources in imaging, microscopy imaging, dimensional measurements, electrical tests, chemical and material characterizations and failure analysis. All characterizations are well adapted for thin silicium and thin System In Package .
Two way to access platform
- Rent equipments with startups training and support
Easy access to characterization tools and failure analysis for each development step leaded by your experts.
- Request for services operated by platform staff
Step 1: A common session to identify your need
Step 2: Remote mode with your experts
|Your needs||Our answer|
|Micro-assembly or material characterization||Non-invasive equipments|
|Manufacturing step control||Tools and complementary methods of analysis (optical, mechanical, electrical …)|