Expertise

A thin border between Academia & Industry

At the border between industry and academia, the platform leverages the skills of each to offer real expertise of staff in line with expectations and business needs.

Services fields

MicroPackaging
prototyping
  • Thinning
  • Bump
Package
characterization
  • prép échantillon
RF-HF-UHF
characterization
  • labo sécu
 
 
Printed
electronics
  • fine pitch
Component
security analysis
  • test & carac

Clean Room & Facilities